Quasi van der Waals Epitaxy of Single Crystalline GaN on Amorphous SiO2/Si(100) for Monolithic Optoelectronic Integration

Author:

Liang Dongdong12,Jiang Bei34,Liu Zhetong345,Chen Zhaolong34,Gao Yaqi12,Yang Shenyuan26,He Rui12,Wang Lulu12,Ran Junxue12,Wang Junxi12,Gao Peng345,Li Jinmin12,Liu Zhongfan347,Sun Jingyu47,Wei Tongbo12ORCID

Affiliation:

1. Research and Development Center for Semiconductor Lighting Technology Institute of Semiconductors Chinese Academy of Sciences Beijing 100083 P. R. China

2. Center of Materials Science and Optoelectronics Engineering University of Chinese Academy of Sciences Beijing 100049 P. R. China

3. Center for Nanochemistry (CNC) Beijing Science and Engineering Center for Nanocarbons Beijing National Laboratory for Molecular Sciences College of Chemistry and Molecular Engineering Peking University Beijing 100871 P. R. China

4. Beijing Graphene Institute (BGI) Beijing 100095 P. R. China

5. Electron Microscopy Laboratory and International Center for Quantum Materials School of Physics Peking University Beijing 100871 P. R. China

6. State Key Laboratory of Superlattices and Microstructures Institute of Semiconductors Chinese Academy of Sciences Beijing 100083 P. R. China

7. College of Energy Soochow Institute for Energy and Materials InnovationS (SIEMIS) Jiangsu Provincial Key Laboratory for Advanced Carbon Materials and Wearable Energy Technologies Soochow University Suzhou 215006 P. R. China

Abstract

AbstractThe realization of high quality (0001) GaN on Si(100) is paramount importance for the monolithic integration of Si‐based integrated circuits and GaN‐enabled optoelectronic devices. Nevertheless, thorny issues including large thermal mismatch and distinct crystal symmetries typically bring about uncontrollable polycrystalline GaN formation with considerable surface roughness on standard Si(100). Here a breakthrough of high‐quality single‐crystalline GaN film on polycrystalline SiO2/Si(100) is presented by quasi van der Waals epitaxy and fabricate the monolithically integrated photonic chips. The in‐plane orientation of epilayer is aligned throughout a slip and rotation of high density AlN nuclei due to weak interfacial forces, while the out‐of‐plane orientation of GaN can be guided by multi‐step growth on transfer‐free graphene. For the first time, the monolithic integration of light‐emitting diode (LED) and photodetector (PD) devices are accomplished on CMOS‐compatible SiO2/Si(100). Remarkably, the self‐powered PD affords a rapid response below 250 µs under adjacent LED radiation, demonstrating the responsivity and detectivity of 2.01 × 105 A/W and 4.64 × 1013 Jones, respectively. This work breaks a bottleneck of synthesizing large area single‐crystal GaN on Si(100), which is anticipated to motivate the disruptive developments in Si‐integrated optoelectronic devices.

Funder

Natural Science Foundation of Beijing Municipality

National Key Research and Development Program of China

National Natural Science Foundation of China

Publisher

Wiley

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