Phononic Thermal Transport along Graphene Grain Boundaries: A Hidden Vulnerability-Reference-Cited by-同舟云学术

Phononic Thermal Transport along Graphene Grain Boundaries: A Hidden Vulnerability

Published:2021-07-21 Issue:18 Volume:8 Page:2101624
ISSN:2198-3844
Container-title:Advanced Science
language:en
Short-container-title:Adv. Sci.

Author:

Tong Zhen¹^ORCID,Pecchia Alessandro²^ORCID,Yam ChiYung¹³,Dumitrică Traian⁴^ORCID,Frauenheim Thomas¹³⁵^ORCID

Affiliation:

1. Shenzhen JL Computational Science and Applied Research Institute Shenzhen 518131 China

2. CNR‐ISMN Via Salaria km 29.300, Monterotondo Rome 00017 Italy

3. Beijing Computational Science Research Center Beijing 100193 China

4. Department of Mechanical Engineering University of Minnesota Minneapolis MN 55455 USA

5. Bremen Center for Computational Materials Science University of Bremen Bremen 2835 Germany

Funder

Deutsche Forschungsgemeinschaft

Postdoctoral Research Foundation of China

National Natural Science Foundation of China

Publisher

Wiley

Subject

General Physics and Astronomy,General Engineering,Biochemistry, Genetics and Molecular Biology (miscellaneous),General Materials Science,General Chemical Engineering,Medicine (miscellaneous)

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/advs.202101624

Reference43 articles.

1. Energy dissipation and transport in nanoscale devices

2. Emerging challenges and materials for thermal management of electronics

3. Phonon thermal conduction in novel 2D materials

4. Colloquium: Phononic thermal properties of two-dimensional materials

5. Basal-plane thermal conductivity of few-layer molybdenum disulfide

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