Thermally Stable Nanotwins: New Heights for Cu Mechanics-Reference-Cited by-同舟云学术

Thermally Stable Nanotwins: New Heights for Cu Mechanics

Published:2022-10-26 Issue:34 Volume:9 Page:2203544
ISSN:2198-3844
Container-title:Advanced Science
language:en
Short-container-title:Advanced Science

Author:

Edwards Thomas Edward James¹^ORCID,Rohbeck Nadia¹,Huszár Emese¹,Thomas Keith¹,Putz Barbara¹²,Polyakov Mikhail Nikolayevich¹,Maeder Xavier¹,Pethö Laszlo¹,Michler Johann¹

Affiliation:

1. Empa Swiss Federal Laboratories for Materials Science and Technology Laboratory for Mechanics of Materials and Nanostructures Feuerwerkerstrasse 39 Thun 3602 Switzerland

2. Department of Materials Science Montanuniversität Leoben Franz Josef‐Strasse 18 Leoben 8700 Austria

Publisher

Wiley

Subject

General Physics and Astronomy,General Engineering,Biochemistry, Genetics and Molecular Biology (miscellaneous),General Materials Science,General Chemical Engineering,Medicine (miscellaneous)

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/advs.202203544

Reference88 articles.

1. The Deformation and Ageing of Mild Steel: III Discussion of Results

2. Hardness and strain rate sensitivity of nanocrystalline Cu

3. Low temperature creep of nanocrystalline pure copper

4. The Effect of Strain Distribution on Abnormal Grain Growth in Cu Thin Films

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