Argon cluster‐ion sputter yield: Molecular dynamics simulations on silicon and equation for estimating total sputter yield-Reference-Cited by-同舟云学术

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Argon cluster‐ion sputter yield: Molecular dynamics simulations on silicon and equation for estimating total sputter yield

Published:2021-07-27 Issue: Volume: Page:
ISSN:0142-2421
Container-title:Surface and Interface Analysis
language:en
Short-container-title:Surf Interface Anal

Author:

Cumpson Peter J.¹²,Jaskiewicz Mieszko¹,Kim Woo Kyun³

Affiliation:

1. NEXUS laboratory, School of Engineering Newcastle University Newcastle upon Tyne UK

2. Now at Mark Wainwright Analytical Centre University of New South Wales Sydney New South Wales Australia

3. Department of Mechanical and Materials Engineering University of Cincinnati Cincinnati Ohio USA

Funder

Engineering and Physical Sciences Research Council

Publisher

Wiley

Subject

Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/sia.6996

Reference35 articles.

1. Materials processing by gas cluster ion beams

2. Gas-cluster ion-beam smoothing of chemo-mechanical-polish processed GaSb(100) substrates

3. The plasmonic properties of argon cluster-bombarded InP surfaces

4. The surface damage in titanium nitride associated with lateral sputtering by argon cluster ions;Perry AJ;Surf Coat Technol,2000

5. Stability of reference masses: VII. cleaning methods in air and vacuum applied to a platinum mass standard similar to the international and national kilogram prototypes;Cumpson PJ;Metrologia,2013

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Comparing sputter rates, depth resolution, and ion yields for different gas cluster ion beams (GCIB): A practical guide to choosing the best GCIB for every application;Journal of Vacuum Science & Technology A;2023-07-28

2. Atom deposition and sputtering at normal incidence simulated by the Frenkel-Kontorova chain;Physical Review E;2022-08-17

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