1. J. Karppinen T. T. Mattila J. K. Kivilahti “Formation of thermomechanical interconnection stresses in a high-end portable product,” The Proceedings of the 2nd Electronics System Integration Technology Conference , London, UK, Sept. 1-4, IEEE/EIA CPMT, (2008), pp. 1327-1332
2. Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment;Karppine;Microelectronics Reliability,2010
3. IEC 60068-2-14 Ed. 5.0 b: 1984, “Environmental testing - part 2: tests. Test N: change of temperature,” International Electrotechnical Commission, (1984), 34 p
4. JESD22-A104C, “Temperature Cycling,” Jedec Solid State Technology Association , (2005), 16 p
5. IPC-TM-650 rev. A, “Thermal Shock and Continuity, Printed Board,” The Institute for Interconnecting and Packaging Electronic Circuits , (1997), 2 p