Author:
Iqbal Asad,Juneja Harpreet,Yao Junpin,Shadman Farhang
Subject
General Chemical Engineering,Environmental Engineering,Biotechnology
Reference26 articles.
1. Future roadblocks and solutions in silicon technology as outlined by the ITRS roadmap
2. National Institute of Standards and Technology (NIST). Characterization of porous low-k dielectric constant thin films. Gaithersburg, MD: Material Science and Engineering Laboratory, Polymers Division, NIST; Accessed in 2005. http://polymers.msel.nist.gov/projects/project-detail.cfm?PID=11.
3. The International Technology Roadmap for Semiconductors (ITRS). Update. San Jose, CA: Semiconductor Association; 2004. May be viewed online at http://public.itrs.net.
4. A study of post-etch wet clean on electrical and reliability performance of Cu/low k interconnections
5. Enhancement of adhesion strength of Cu layer on single and multi-layer dielectric film stack in Cu/low k multi-level interconnects
Cited by
8 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献