<scp>Ultra‐Soft</scp> Neural Probe with a Temporary <scp>High‐Strength U‐Section</scp> Coating by Picosecond Laser Micromachining-Reference-Cited by-同舟云学术

Ultra‐Soft Neural Probe with a Temporary High‐Strength U‐Section Coating by Picosecond Laser Micromachining

Published:2024-01-08 Issue: Volume: Page:
ISSN:1931-4973
Container-title:IEEJ Transactions on Electrical and Electronic Engineering
language:en
Short-container-title:IEEJ Transactions Elec Engng

Author:

You Xiaoli¹,Sun Fanqi¹,Zhou Yuhao¹,Wang Minghao²,Xu Mengfei³,Yuan Xichen⁴,Chang Honglong⁴,Liu Jingquan³,Ji Bowen¹

Affiliation:

1. Unmanned System Research Institute Northwestern Polytechnical University Xi'an 710072 China

2. College of Electronics and Information Hangzhou Dianzi University Hangzhou 310018 China

3. National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Department of Micro/Nano Electronics Shanghai Jiao Tong University Shanghai 200240 China

4. Ministry of Education Key Laboratory of Micro/Nano Systems for Aerospace, School of Mechanical Engineering Northwestern Polytechnical University Xi'an 710072 China

Abstract

This paper reports an ultra‐soft neural probe with a temporary high‐strength U‐section coating of polyethylene glycol (PEG) for the first time. Its fabrication is compatible with MEMS processes, and an ultrathin U‐section coating over the probe's back and sidewall is precisely formed by spinning and cold laser cutting. With this novel coating, the probe has both minimized cross‐sectional area and sufficient mechanical strength for low‐invasive penetration into the brain. Besides, the remained ultra‐soft deformable probe after PEG dissolution is expected to be the next generation of neural implants for chronic recording. © 2024 Institute of Electrical Engineers of Japan. Published by Wiley Periodicals LLC.

Funder

National Natural Science Foundation of China

Key Research and Development Projects of Shaanxi Province

Natural Science Foundation of Chongqing Municipality

Publisher

Wiley

Subject

Electrical and Electronic Engineering

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/tee.23985

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