Modeling and simulation of curing processes using time‐adaptive, high‐order time integration-Reference-Cited by-同舟云学术

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Modeling and simulation of curing processes using time‐adaptive, high‐order time integration

Published:2018-12 Issue:1 Volume:18 Page:
ISSN:1617-7061
Container-title:PAMM
language:en
Short-container-title:Proc. Appl. Math. Mech.

Author:

Leistner Chris¹,Abliz Dilmurat²,Ziegmann Gerhard²,Hartmann Stefan¹

Affiliation:

1. Institute of Applied MechanicsClausthal University of Technology Adolph‐Roemer‐Str. 2a 38678Clausthal‐Zellerfeld Germany

2. Institute of Polymer Materials and Plastics EngineeringClausthal University of Technology Agricolastraße 6 38678Clausthal‐Zellerfeld Germany

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pamm.201800152

Reference4 articles.

1. M. R.Kamal Thermoset characterization for moldability analysis Polymer Engineering & Science 14 pp. 231–239(1974).

2. J.Fournier G.Williams C.Duch G. A.Aldridge Changes in Molecular Dynamics during Bulk Polymerization of an Epoxide‐Amine System As Studied by Dielectric Relaxation Spectroscopy Macromolecules 29 pp. 7097–7107(1996).

3. S.Krämer S.Rothe S.Hartmann Homogeneous stress‐strain states computed by 3D‐stress algorithms of FE‐codes: application to material parameter identification Engineering with Computers 31 pp. 141–159(2015).

4. C.Leistner S.Hartmann D.Abliz G.Ziegmann Modeling and simulation of the curing process of epoxy resins using finite elements submitted to Continuum Mechanics and Thermodynamics(2018).

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