Experiments, modelling and simulation of adhesive curing processes in bonded three dimensional curved piezo metal composite structures
Author:
Publisher
Wiley
Subject
Electrical and Electronic Engineering,Atomic and Molecular Physics, and Optics
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/pamm.201410105/fullpdf
Reference4 articles.
1. W.-G. Drossel S. Hensel B. Kranz M. Nestler A. Goeschel Sheet metal forming of piezoceramic-metal-laminar structures - simulation and experimental analysis. Cirp Ann - Manuf Techn 58(1), pp 279-282 (2009)
2. R. Landgraf M. Rudolph R. Scherzer J. Ihlemann Modelling and simulation of adhesive curing processes in bonded piezo metal composites. Comput Mech, DOI: 10.1007/s00466-014-1005-5 (in press)
3. S. Nebel Ein Beitrag zur experimentellen und numerischen Analyse zeitabhängiger Eigenschaften von DMS-Messstellen. Dissertation, TU Chemnitz (2009)
4. M. Rudolph M. Stockmann R. Landgraf J. Ihlemann http://arxiv.org/abs/1404.0310
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