A new method to evaluate solvent stress cracking
Author:
Publisher
Wiley
Subject
Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry
Reference24 articles.
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1. Crazing of Photoimageable Dielectric (PID) in Fan-Out Panel Level Packaging (FOPLP);2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
2. An alternative method of solvent‐induced stresses in an elastic thin slab: Moutier theorem;Polymer Engineering & Science;2022-02
3. Influence of liquid media on the craze initiation in amorphous polylactide;Polymer;2018-04
4. Mechanoluminescent Imaging of Osmotic Stress-Induced Damage in a Glassy Polymer Network;Macromolecules;2017-03-02
5. Residual stresses in injection molded products;Journal of Materials Science;2014-03-28
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