Publisher
John Wiley & Sons (Asia) Pte Ltd
Reference42 articles.
1. 2009
2. Awad , E. 2004 Active devices and wiring under chip bond pads: Stress simulations and modeling methodology Proceedings of 54 Electronic Components and Technology Conference 1784 1787
3. An internal variable constitutive model for hot working of metals;Brown;International Journal of Plasticity,1989
4. Mechanical FEM simulation of bonding process on Cu LowK wafers;Degryse;IEEE Transactions on Components and Packaging Technologies,2004