Pore sealing mechanism in OSG low‐ k films under ion bombardment
Author:
Affiliation:
1. Skobeltsyn Institute of Nuclear PhysicsLomonosov Moscow State UniversityMoscow Russia
2. Faculty of PhysicsLomonosov Moscow State UniversityMoscow Russia
Funder
Russian Science Foundation
Publisher
Wiley
Subject
Polymers and Plastics,Condensed Matter Physics
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/ppap.201900165
Reference58 articles.
1. Damage mechanism in low-dielectric (low-k) films during plasma processes
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5. The effect of He plasma treatment on properties of organosilicate glass low-k films
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