An atmospheric pressure non‐self‐sustained glow discharge in between metal/metal and metal/liquid electrodes
Author:
Affiliation:
1. Department of Applied Physics Ghent University Gent Belgium
2. Chimie des Interactions Plasma‐Surface (ChIPS), CIRMAP Mons University Mons Belgium
3. Materia Nova Research Centre Parc Initialis Mons Belgium
Funder
FWO/ARRS Agencies
NITROPLASM EOS Project
Publisher
Wiley
Subject
Polymers and Plastics,Condensed Matter Physics
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/ppap.201900191
Reference48 articles.
1. Plasma Physics and Engineering
2. Principles of Plasma Discharges and Materials Processing
3. Applied Plasma Medicine
4. Plasma Technology: An Emerging Technology for Energy Storage
5. Energy Considerations for Plasma-Assisted N-Fixation Reactions
Cited by 12 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Simulation of low-current DC discharges in longitudinal flows of atmospheric-pressure air;Plasma Sources Science and Technology;2024-05-01
2. Degradation of perfluoroalkyl and polyfluoroalkyl substances (PFAS) in water by use of a nonthermal plasma-ozonation cascade reactor: Role of different processes and reactive species;Chemical Engineering Journal;2024-04
3. Two-dimensional numerical simulation of pre-ionized direct-current glow discharge in atmospheric helium;Acta Physica Sinica;2024
4. Characterization of Non-Thermal Dielectric Barrier Discharges for Plasma Medicine: From Plastic Well Plates to Skin Surfaces;Plasma Chemistry and Plasma Processing;2023-09-27
5. Nitrogen Oxidation in a Multi-Pin Plasma System in the Presence and Absence of a Plasma/Liquid Interface;Applied Sciences;2023-06-28
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3