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Substrate integrated waveguide filter on LCP substrate at 94 GHz

  • Published:2016-01-27 Issue:3 Volume:58 Page:577-580
  • ISSN:0895-2477
  • Container-title:Microwave and Optical Technology Letters
  • language:en
  • Short-container-title:Microw. Opt. Technol. Lett.

Author:

Zhang Yifei1,Shi Shouyuan1,Martin Richard D.1,Prather Dennis W.1

Affiliation:

1. Electrical and Computer Engineering; University of Delaware, Evans 140, University of Delaware; Newark Delaware

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference11 articles.

1. Review of substrate-integrated waveguide circuits and antennas;Bozzi;IET Micorwave Antenna Propagation,2011

2. Concerning the influence of housing dimensions on the response and design of microstrip filters with parallel-line couplings;Matthaei;IEEE Trans Microwave Theory Tech,2000

3. Compace millimeter-wave filters using distributed capacitively loaded CPW resonators;Aryanfar;IEEE Trans Microwave Theory Tech,2006

4. W-band microstrip band-pass filter using branch-line coupler with open stubs;Hwang;Microwave Opt Technol Lett,2011

5. Substrate integrated waveguide filter with improved stopband performance for satellite ground terminal;Chen;IEEE Trans Microwave Theory Tech,2009

Cited by 11 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Frequency Division Multiplexer With Directional Filters in Multilayer LCP Films at - and -Band ;IEEE Microwave and Wireless Components Letters;2022-11

2. Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications;IEEE Transactions on Components, Packaging and Manufacturing Technology;2022-10

3. Flexible Liquid Crystal Polymer Technologies from Microwave to Terahertz Frequencies;Molecules;2022-02-16

4. Spoof surface plasmon polariton band‐stop filter with single‐loop split ring resonators;International Journal of RF and Microwave Computer-Aided Engineering;2020-05-13

5. 95-GHz Front-End Receiving Multichip Module on Multilayer LCP Substrate for Passive Millimeter-Wave Imaging;IEEE Transactions on Components, Packaging and Manufacturing Technology;2018-12
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