Lightweight, low temperature fatigue resistant, and low dielectric microcellular polyetheretherketone foams fabricated by microcellular injection molding-Reference-Cited by-同舟云学术

Lightweight, low temperature fatigue resistant, and low dielectric microcellular polyetheretherketone foams fabricated by microcellular injection molding

Published:2022-08-05 Issue:41 Volume:139 Page:
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J of Applied Polymer Sci

Author:

Ma Yitao¹^ORCID,Xie Jinzhao¹,Li Zhongjie¹,Liu Gonghan¹,Yang Weimin¹²,Xie Pengcheng¹²³^ORCID

Affiliation:

1. College of Mechanical and Electrical Engineering Beijing University of Chemical Technology Beijing People's Republic of China

2. State Key Laboratory of Organic‐Inorganic Composites Beijing University of Chemical Technology Beijing People's Republic of China

3. Interdisciplinary Research Center for Artificial Intelligence Beijing University of Chemical Technology Beijing People's Republic of China

Funder

Natural Science Foundation of Beijing Municipality

Fundamental Research Funds for the Central Universities

National Basic Research Program of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.52983

Reference28 articles.

1. Process-microstructure-electrical conductivity relationships in injection-molded polypropylene/carbon nanotube nanocomposite foams

2. Lightweight, thermally insulating, and low dielectric microcellular high-impact polystyrene (HIPS) foams fabricated by high-pressure foam injection molding with mold opening

3. Poly(vinylidene fluoride) foams: a promising low-k dielectric and heat-insulating material

4. Intrinsic low dielectric constant polyimides: relationship between molecular structure and dielectric properties

5. Transparent and soluble polyimide films containing 4,4′-isopropylidenedicyclohexanol (Cis -HBPA) units: Preparation, characterization, thermal, mechanical, and dielectric properties

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