ChemInform Abstract: Reactive Ion Etching of Copper Films in a SiCl4, N2, Cl2, and NH3 Mixture.
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Published:2010-08-04
Issue:14
Volume:28
Page:no-no
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ISSN:0931-7597
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Container-title:ChemInform
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language:en
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Short-container-title:ChemInform
Author:
OHNO K.,SATO M.,ARITA Y.