Understanding and Improving Mechanical Stability in Electrodeposited Cu and Bi for Dynamic Windows Based on Reversible Metal Electrodeposition-Reference-Cited by-同舟云学术

Understanding and Improving Mechanical Stability in Electrodeposited Cu and Bi for Dynamic Windows Based on Reversible Metal Electrodeposition

Author:

McAndrews Gabriel R.¹,Yeang Andrew L.²,Cai Yuchun³,Barile Christopher J.⁴,McGehee Michael D.¹²^ORCID

Affiliation:

1. Materials Science and Engineering Program University of Colorado Boulder Boulder CO 80303 USA

2. Department of Chemical and Biological Engineering University of Colorado Boulder Boulder CO 80303 USA

3. Department of Chemistry University of Colorado Boulder Boulder CO 80303 USA

4. Department of Chemistry University of Nevada Reno Reno NV 89503 USA

Funder

National Science Foundation

Publisher

Wiley

Subject

General Materials Science,Renewable Energy, Sustainability and the Environment

Link

Reference66 articles.

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