Highly Densified Cu Wirings Fabricated from Air‐Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility-Reference-Cited by-同舟云学术

Highly Densified Cu Wirings Fabricated from Air‐Stable Cu Complex Ink with High Conductivity, Enhanced Oxidation Resistance, and Flexibility

Author:

Li Wanli¹²^ORCID,Yang Yang²³,Zhang Bowen¹²,Li Cai‐Fu²,Jiu Jinting²⁴,Suganuma Katsuaki²

Affiliation:

1. Department of Adaptive Machine Systems Graduate School of Engineering Osaka University Yamadaoka 2‐1 Suita Osaka 567‐0047 Japan

2. The Institute of Scientific and Industrial Research (ISIR) Osaka University Mihogaoka 8‐1 Ibaraki Osaka 567‐0047 Japan

3. Pacific Northwest National Laboratory P.O. Box 999 Richland WA 99352 USA

4. Senju Metal Industry Co., Ltd. Senju Hashido‐cho 23 Adachi‐ku Tokyo 120‐8555 Japan

Funder

Advanced Low Carbon Technology Research and Development Program

China Scholarship Council

Japan Society for the Promotion of Science

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Link

Reference43 articles.

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