Improving Thermal Transport at Carbon Hybrid Interfaces by Covalent Bonds

Author:

Sun Shuangxi123,Samani Majid Kabiri1,Fu Yifeng1,Xu Tao4,Ye Lilei5,Satwara Maulik1,Jeppson Kjell1,Nilsson Torbjörn1,Sun Litao4,Liu Johan12

Affiliation:

1. Electronics Materials and Systems Laboratory; Department of Microtechnology and Nanoscience; Chalmers University of Technology; SE-412 96 Gothenburg Sweden

2. SMIT Center; School of Mechanical Engineering and Automation; Shanghai University; 201800 Shanghai P. R. China

3. Fingerprint Cards AB; SE-411 19 Gothenburg Sweden

4. SEU-FEI Nano-Pico Center; Key Lab of MEMS of Ministry of Education; Southeast University; Nanjing 210096 P. R. China

5. SHT Smart High Tech AB; Aschebergsgatan 46 SE-411 33 Gothenburg Sweden

Publisher

Wiley

Subject

Mechanical Engineering,Mechanics of Materials

Reference48 articles.

1. Graphene transistors

2. Cooling a Microprocessor Chip

3. Thermal Interface Materials: Historical Perspective, Status, and Future Directions

4. S. Sun W. Mu Y. Zhang B. Carlberg L. Ye J. Liu The ICEPT-HDP 2012 Proceedings-2012 13th Int. Conf. on Electronic Packaging Technology and High Density Packaging IEEE Guilin, China 171 176

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