A study on the effect of wire bonding interconnects of BCB capped CPW to CPW on LTCC substrate
Author:
Affiliation:
1. IEMN CNRS; Villeneuve d'Ascq Cedex 59652 France
2. School of mechanical and aerospace engineering, Seoul National University; Seoul 151-744 Korea
3. VTT Technical Research Centre of Finland; Kaitovayla 1, FI-90571 VTT Oulu Finland
Funder
European Union for the funding and support of the FP7 project MEMSPACK
Publisher
Wiley
Subject
Electrical and Electronic Engineering,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/mop.28355/fullpdf
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