The 2-D boundary element techniques for capacitance extraction of nanometer VLSI interconnects-Reference-Cited by-同舟云学术

The 2-D boundary element techniques for capacitance extraction of nanometer VLSI interconnects

Published:2013-12-26 Issue:4 Volume:27 Page:656-668
ISSN:0894-3370
Container-title:International Journal of Numerical Modelling: Electronic Networks, Devices and Fields
language:en
Short-container-title:Int. J. Numer. Model.

Author:

Zhai Kuangya¹,Yu Wenjian¹

Affiliation:

1. Department of Computer Science and Technology; Tsinghua University; Beijing 100084 China

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Computer Science Applications,Modeling and Simulation

Reference18 articles.

1. Gong W Yu W Lü Y Tang Q Zhou Q Cai Y A parasitic extraction method of VLSI interconnects for pre-route timing analysis Proc. International Conference on Communications Circuits and Systems ICCCAS 2010 871 875

2. Algebraic multigrid Laplace solver for the extraction of capacitances of conductors in multi-layer dielectrics;Sumant;Int J Numer Model,2007

3. Analysis of quadruple corner-cut ridged square waveguide by hybrid mode-matching boundary-element method;Tao;Int J Numer Model,2011

4. Radio frequency simulation of a complex printed circuit board layout by the quasistatic boundary element method;Milsom;Int J Numer Model,1988

Cited by 17 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Parasitic Capacitance Patterns Grid Density Binarization and Shifted Reflection Step Sequence Encoding for Dimensionality Reduction;2024 25th International Symposium on Quality Electronic Design (ISQED);2024-04-03

2. On the Features of Calculating per-Unit-Length Parameters and Characteristics of Multiconductor Transmission Lines;Journal of Communications Technology and Electronics;2023-12

3. On the Features of Calculating Linear Parameters and Characteristics of Multi-Wire Transmission Lines;Радиотехника и электроника;2023-12-01

4. Accurate Capacitance Matrices for Multiconductor Transmission Lines;IEEE Transactions on Electromagnetic Compatibility;2022-10

5. A 2-D Capacitance Solver with Finite Difference Method;2020 China Semiconductor Technology International Conference (CSTIC);2020-06-26