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2. New optical and electrical hybrid packaging techniques using optical waveguides for optoelectronic multichip modules
3. 3D micro optical switching system (3D-MOSS)?Packaging design. 2001 IEEE LEOS Annual Meeting Conference Proceedings, San Diego, p 499-500.
4. Unexamined Japanese Patent Publication No. 4-181231, ?Waveguide Type Electrooptical Device? and Unexamined Japanese Patent Publication No. 4-204633, ?Optical Integrated Circuit Device.? (in Japanese)