Crosslink network and phenyl content on the optical, hardness, and thermal aging of PDMS LED encapsulant-Reference-Cited by-同舟云学术

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Crosslink network and phenyl content on the optical, hardness, and thermal aging of PDMS LED encapsulant

Published:2019-05-03 Issue:34 Volume:136 Page:47895
ISSN:0021-8995
Container-title:Journal of Applied Polymer Science
language:en
Short-container-title:J Appl Polym Sci

Author:

Lay Makara¹^ORCID,Ramli Mohamad Riduwan¹,Ramli Rafiza²,Mang Ng Chee³,Ahmad Zulkifli¹^ORCID

Affiliation:

1. School of Materials and Mineral Resources EngineeringEngineering Campus, Universiti Sains Malaysia 14300, Nibong Tebal Pulau Pinang Malaysia

2. Lumileds Malaysia Sdn. Bhd No. 3, Lintang Bayan Lepas 8, Phase 4, Bayan Lepas Industrial Park, 11900, Pulau Penang Malaysia

3. Penchem Technologies Sdn Bhd 1015 Jln Perindustrian Bukit Minyak7, Kaw Perindustrian Bukit Minyak, 14100 Penang Malaysia

Funder

Penchem Technology Sdn Bhd

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/app.47895

Reference22 articles.

1. Comparison of epoxy resins for applications in light-emitting diodes

2. Synthesis and application of epoxy resins: A review

3. Effect of silicone resin modification on the performance of epoxy materials for LED encapsulation

4. High refractive index adamantane-based silicone resins for the encapsulation of light-emitting diodes

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1. Polymers in optoelectronic devices;Polymers in Electronics;2023

2. One-step synthesis of novel multifunctional silicone acrylate prepolymers for use in UV-curable coatings;Progress in Organic Coatings;2022-02

3. Influence of POSS Type on the Space Environment Durability of Epoxy-POSS Nanocomposites;Nanomaterials;2022-01-14

4. Long-Term Thermal Aging of Modified Sylgard 184 Formulations;Polymers;2021-09-16

5. Fabrication of advanced polydimethylsiloxane-based functional materials: Bulk modifications and surface functionalizations;Chemical Engineering Journal;2021-03

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