Ultra‐high <i>T</i> <sub>g</sub> and ultra‐low coefficient of thermal expansion polyimide films based on hydrogen bond interaction-Reference-Cited by-同舟云学术

Ultra‐high T _g and ultra‐low coefficient of thermal expansion polyimide films based on hydrogen bond interaction

Published:2022-04-28 Issue:16 Volume:60 Page:2454-2464
ISSN:2642-4150
Container-title:Journal of Polymer Science
language:en
Short-container-title:Journal of Polymer Science

Author:

Jiao Long¹²,Zhang Yanna³,Du Zhijun¹^ORCID,Dai Xuemin¹,Wang Hanfu¹,Dong Zhixin¹,Yao Haibo¹²,Qiu Xuepeng¹²^ORCID

Affiliation:

1. CAS Key Laboratory of High‐Performance Synthetic Rubber and Its Composite Materials Changchun Institute of Applied Chemistry, Chinese Academy of Sciences Changchun China

2. University of Science and Technology of China Hefei China

3. The 39th Research Institute of China Electronics Technology Group Corporation Xi'an China

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,Physical and Theoretical Chemistry

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pol.20220177

Reference59 articles.

1. Printable and flexible electronics: from TFTs to bioelectronic devices

2. Flexible Organic Electronics in Biology: Materials and Devices

3. Flexible organic semiconductor thin films

4. Superheat-resistant polymers with low coefficients of thermal expansion

5. LTPS TFT Process on Polyimide Substrate for Flexible AMOLED

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