Materials Compatibility and Co-Sintering Aspects in Low Temperature Co-Fired Ceramic Packages-Reference-Cited by-同舟云学术

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Materials Compatibility and Co-Sintering Aspects in Low Temperature Co-Fired Ceramic Packages

Published:2008-03-26 Issue: Volume: Page:1603-1617
ISSN:1940-6339
Container-title:Cofire Technology: Ceramic Engineering and Science Proceedings, Volume 9, Issue 11/12
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Author:

Sawhill Howard T.

Publisher

John Wiley & Sons, Inc.

Reference37 articles.

1. R. Keeler “Co-Fired Ceramic Multilayers: When Reliability Counts,” 40 41 1987

2. “Thick-Film Technology: An Introduction to the Materials,”;Larry;IEEE Transactions,1980

3. “Thermal Conduction Module: A High-Performance Multilayer Ceramic Package,”;Blodget;IBM J. Res. Dev.,1982

4. C. H. Bhedwar A. L. Eustice S. J. Horowitz F. K. Patterson H. T. Sawhill “Low Temperature Co-Fired Ceramic Tape System-An Overview,” 720 34 1987

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