Three‐dimensional (3D)‐printed MXene high‐voltage aqueous micro‐supercapacitors with ultrahigh areal energy density and low‐temperature tolerance

Author:

Zhu Yuanyuan12ORCID,Zhang Qingxiao3,Ma Jiaxin14ORCID,Das Pratteek14,Zhang Liangzhu1,Liu Hanqing14,Wang Sen1,Li Hui3,Wu Zhong‐Shuai15ORCID

Affiliation:

1. State Key Laboratory of Catalysis, Dalian Institute of Chemical Physics Chinese Academy of Sciences Dalian China

2. Key Laboratory of Spin Electron and Nanomaterials of Anhui Higher Education Institutes Suzhou University Suzhou China

3. Shanghai Key Laboratory of Rare Earth Functional Materials and Education Ministry Key Laboratory of Resource Chemistry Shanghai Normal University Shanghai China

4. University of Chinese Academy of Sciences Beijing China

5. Dalian National Laboratory for Clean Energy Chinese Academy of Sciences Dalian China

Abstract

AbstractThe rapid advancement in the miniaturization, integration, and intelligence of electronic devices has escalated the demand for customizable micro‐supercapacitors (MSCs) with high energy density. However, efficient microfabrication of safe and high‐energy MXene MSCs for integrating microelectronics remains a significant challenge due to the low voltage window in aqueous electrolytes (typically ≤0.6 V) and limited areal mass loading of MXene microelectrodes. Here, we tackle these challenges by developing a high‐concentration (18 mol kg−1) “water‐in‐LiBr” (WiB) gel electrolyte for MXene symmetric MSCs (M‐SMSCs), demonstrating a record high voltage window of 1.8 V. Subsequently, additive‐free aqueous MXene ink with excellent rheological behavior is developed for three‐dimensional (3D) printing customizable all‐MXene microelectrodes on various substrates. Leveraging the synergy of a high‐voltage WiB gel electrolyte and 3D‐printed microelectrodes, quasi‐solid‐state M‐SMSCs operating stably at 1.8 V are constructed, and achieve an ultrahigh areal energy density of 1772 μWh cm−2 and excellent low‐temperature tolerance, with a long‐term operation at −40°C. Finally, by extending the 3D printing protocol, M‐SMSCs are integrated with humidity sensors on a single planar substrate, demonstrating their reliability in miniaturized integrated microsystems.

Funder

National Natural Science Foundation of China

Publisher

Wiley

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