Etching Species Generation

Author:

Publisher

Wiley

Reference55 articles.

1. Effect of non‐sinusoidal bias waveforms on ion energy distributions and fluorocarbon plasma etch selectivity;Agarwal A.;J. Vac. Sci. Technol., A,2005

2. Negative ion measurements and etching in a pulsed‐power inductively coupled plasma in chlorine;Ahn T.H.;Plasma Sources Sci. Technol.,1996

3. Driving frequency effect on the electron energy distribution function in capacitive discharge under constant discharge power condition;Ahn S.K.;Appl. Phys. Lett.,2006

4. Inductively coupled pulsed plasmas in the presence of synchronous pulsed substrate bias for robust, reliable, and fine conductor etching;Banna S.;IEEE Trans. Plasma Sci.,2009

5. Pulsed high‐density plasmas for advanced dry etching processes;Banna S.;J. Vac. Sci. Technol., A,2012

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