1. Wafer level packaging of MEMS;Esashi M.;J. Micromech. Microeng.,2008
2. Matsumoto Y. Shoji S. andEsashi M.(1990).A miniature integrated capacitive pressure sensor. 22nd Conf. on Solid State Devices and Materials Sendai Japan (22–24 August 1990) 701.
3. Shoji S.andEsashi M.(1990).Photoetching and electrochemical discharge drilling of Pyrex glass. Tech. Digest of the 9thSensor Symp. Tokyo Japan (30–31 May 1990) 25–28.
4. Guckel H.andBurns D.W.(1985).Laser‐recrystallized piezoresistive micro‐diaphragm sensor. Digest of Technical Papers The 3rd Int. Conf. on Solid State Sensors and Actuators (Transducers'85) Stockholm Sweden (25–29 June 1985) 182–185.
5. Shoji S. Nisase T. Esashi M. andMatsuo T.(1987).Fabrication of an implantable capacitive type pressure sensor. Digest of Technical Papers The 4th Int. Conf. on Solid State Sensors and Actuators (Transducers'87) Tokyo Japan (2–5 June 1987) 305–308.