Reactive Bonding-Reference-Cited by-同舟云学术

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Reactive Bonding

Published:2021-04-23 Issue: Volume: Page:309-329
ISSN:
Container-title:3D and Circuit Integration of MEMS
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Author:

Vogel Klaus,Braun Silvia,Hofmann Christian,Weiser Mathias,Wiemer Maik,Otto Thomas,Kuhn Harald

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/9783527823239.ch14

Reference41 articles.

1. Thermochimica Acta

2. Theoretical energy release of thermites, intermetallics, and combustible metals;Fischer S.H.;Int. Pyrotech. Semin.,1998

3. Modelling the reaction behavior in reactive multilayer systems on substrates used for wafer bonding;Masser R.;J. Appl. Phys.,2014

4. Effect of intermixing on self‐propagating exothermic reactions in Al/Ni nanolaminate foils;Gavens A.J.;J. Appl. Phys.,2000

5. Self‐propagating reactions in Al/Zr multilayers: anomalous dependence of reaction velocity on bilayer thickness;Barron S.C.;J. Appl. Phys.,2013

Cited by 3 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An MD-study on changing the elemental distribution and composition by alloying to control front propagation in Al–Ni multilayers;Journal of Applied Physics;2022-08-14

2. The Mechanism of Joint Reduction of MoO3 and CuO by Combined Mg/C Reducer at High Heating Rates;Journal of Composites Science;2021-12-03

3. Investigation of Integrated Reactive Multilayer Systems for Bonding in Microsystem Technology;Micromachines;2021-10-19

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