1. Franke A.E. (2000).Polycrystalline silicon‐germanium films for integrated microsystems. Ph.D. Thesis University of California at Berkeley.
2. Heck J.M. (2001).Polycrystalline silicon germanium for fabrication release and packaging of microelectromechanical systems. Ph.D. Thesis University of California at Berkeley.
3. Characterization of polycrystalline silicon‐germanium film deposition for modularly integrated MEMS applications;Low C.W.;IEEE/ASME J. Microelectromech. Syst.,2007
4. Witvrouw A. Mehta A. Verbist A. et al. (2005).Processing of MEMS gyroscopes on top of CMOS ICs. Proceedng of 52nd IEEE International Solid‐State Circuits Conference San Francisco CA (6–10 February 2005) 88–89.
5. Characterization and optimization of infrared poly SiGe bolometers;Sedky S.;IEEE Trans. Electron Devices,1999