Effect of Cooling Rate on the Microstructure, Mechanical Properties, and Creep Resistance of a Cast Zn-Al-Mg High-temperature Lead-Free Solder Alloy
Author:
Affiliation:
1. University of Tehran; College of Engineering, School of Metallurgical and Materials Engineering; Tehran Iran
Publisher
Wiley-VCH Verlag GmbH & Co. KGaA
Link
http://onlinelibrary.wiley.com/wol1/doi/10.1002/9783527813964.ch4/fullpdf
Reference44 articles.
1. Interfacial reactions and growth kinetics for intermetallic compound layer between In-48Sn solder and bare Cu substrate;Kim;Journal of Alloys and Compounds,2005
2. Room temperature indentation creep of lead-free Sn-5%Sb solder alloys;Geranmayeh;Journal of Electronic Materials,2005
3. High-temperature shear strength of lead-free Sn-Sb-Ag/Al2O3 composite solder;Geranmayeh;Materials Science and Engineering A,2011
4. Influence of Zn addition on the microstructure, melt properties and creep behavior of low Ag-content Sn-Ag-Cu lead-free solders;El-Daly;Materials Science and Engineering A,2014
5. Advances in lead-free electronics soldering;Suganuma;Current Opinions in Solid State Materials Science,2001
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