Compressive-shear adhesion characterization of polyvinyl-butyral and ethylene-vinyl acetate at different curing times before and after exposure to damp-heat conditions-Reference-Cited by-同舟云学术

Compressive-shear adhesion characterization of polyvinyl-butyral and ethylene-vinyl acetate at different curing times before and after exposure to damp-heat conditions

Published:2012-09-07 Issue:4 Volume:22 Page:405-414
ISSN:1062-7995
Container-title:Progress in Photovoltaics: Research and Applications
language:en
Short-container-title:Prog. Photovolt: Res. Appl.

Author:

Chapuis Valentin¹,Pélisset Ségolène¹,Raeis-Barnéoud Marylène¹,Li Heng-Yu¹,Ballif Christophe¹,Perret-Aebi Laure-Emmanuelle¹

Affiliation:

1. Photovoltaics and Thin Film Electronics Laboratory; Ecole Polytechnique Fédérale de Lausanne (EPFL); Rue A.-L. Breguet 2 CH-2000 Neuchâtel Switzerland

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Link

http://onlinelibrary.wiley.com/wol1/doi/10.1002/pip.2270/fullpdf

Reference31 articles.

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2. Delamination behaviour of multi-layer films for PV encapsulation.;Oreski;Solar Energy Materials and Solar Cells,2005

3. Moisture transport, adhesion, and corrosion protection of PV module packaging materials;Jorgensen;Solar Energy Materials and Solar Cells,2006

4. Jorgensen G Terwilliger K Glick S Pern J McMahon T Material testing for PV module encapsulation 2003

5. Investigation of delamination in an edge-defined film-fed growth photovoltaic module;Van Dyk;Solar Energy Materials and Solar Cells,2005

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