Compressive-shear adhesion characterization of polyvinyl-butyral and ethylene-vinyl acetate at different curing times before and after exposure to damp-heat conditions

Author:

Chapuis Valentin1,Pélisset Ségolène1,Raeis-Barnéoud Marylène1,Li Heng-Yu1,Ballif Christophe1,Perret-Aebi Laure-Emmanuelle1

Affiliation:

1. Photovoltaics and Thin Film Electronics Laboratory; Ecole Polytechnique Fédérale de Lausanne (EPFL); Rue A.-L. Breguet 2 CH-2000 Neuchâtel Switzerland

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Condensed Matter Physics,Renewable Energy, Sustainability and the Environment,Electronic, Optical and Magnetic Materials

Reference31 articles.

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3. Moisture transport, adhesion, and corrosion protection of PV module packaging materials;Jorgensen;Solar Energy Materials and Solar Cells,2006

4. Jorgensen G Terwilliger K Glick S Pern J McMahon T Material testing for PV module encapsulation 2003

5. Investigation of delamination in an edge-defined film-fed growth photovoltaic module;Van Dyk;Solar Energy Materials and Solar Cells,2005

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