Effects of temperature and voids on the interfacial fracture of Si/a-Si3N4bilayer systems
Author:
Affiliation:
1. School of Mechanical and Aerospace Engineering; Nanyang Technological University of Singapore; 50 Nanyang Avenue Singapore 639798 Singapore
2. Infineon Technologies Pte Ltd.; 8 Kallang Sector Singapore 349282 Singapore
Publisher
Wiley
Subject
Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Reference39 articles.
1. Demystifying 3D ICs: The Pros and Cons of Going Vertical
2. Analytical stress singularities for a crack at a Bi- or triple junction of dissimilar materials with bilinear behavior
3. A combined experimental and analytical approach for interface fracture parameters of dissimilar materials in electronic packages
4. Interfacial Delamination Near Solder Bumps and UBM in Flip-Chip Packages
5. Atomistic simulations on the tensile debonding of an aluminum–silicon interface
Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Application of molecular dynamics simulation in mechanical problems;Molecular Dynamics Simulation;2022
2. Atomistic aspects of the temperature effect on fracture toughness of a silicon single crystal;Computational Materials Science;2021-07
3. Mixed-mode fracture toughness testing of a Cu/Ag bimetallic interface via atomistic simulations;Computational Materials Science;2020-10
4. Effects of constituting material and interfacial crack on mechanical response of nanoscale metallic bilayers – a quasi-continuum study;Molecular Simulation;2020-08-20
5. Characterization of interfacial delamination in multi-layered integrated circuit packaging;Surface and Coatings Technology;2017-06
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3