Thermally conductive process and mechanism of TATB‐based polymer‐bonded explosives filled with graphene: Effects of interfacial thermal resistance and morphology/content of graphene

Author:

Zhou Bo1,Zhang Xiaomeng2,Zhang Gang1ORCID,Zhao Xu3

Affiliation:

1. Hubei Provincial Key Laboratory of Chemical Equipment Intensification and Intrinsic Safety, School of Mechanical and Electrical Engineering Wuhan Institute of Technology Wuhan P.R. China

2. School of Materials Science and Engineering Zhengzhou University Zhengzhou P.R. China

3. Institute of Chemical Material China Academy of Engineering Physics Mianyang P.R. China

Abstract

AbstractThe thermal conductivity of energy‐containing materials has a significant impact on their environmental suitability during manufacturing, transportation, and storage. In order to effectively regulate the thermal conductivity of polymer‐bonded explosives (PBXs), this study investigates the effects of different aspect ratios of graphene binder and interfacial thermal resistance on the thermal conductivity of TATB‐based PBXs using the finite element method. A model was constructed using Abaqus software to establish the constitutive relationship between graphene with varying aspect ratios and the thermal conductivity of PBXs. The results indicate that the effect of different graphene aspect ratios on the overall thermal conductivity of PBXs is small when the graphene content is lower than 3%. However, the thermal conductivity of PBXs increases nonlinearly with the increase in graphene aspect ratio when the graphene content is higher than 8%. Furthermore, the interfacial thermal resistance reduces the thermal conductivity of the PBX system by approximately 0.16 W/(m K), and its effect on the thermal conductivity of the system is relatively stable and does not change significantly with increasing graphene content and aspect ratio.Highlights Thermally conductive behavior of graphene‐filled PBX is revealed by simulation. The effects of content and aspect ratio of graphene are systematically investigated. The effect of interface thermal resistance is considered in the simulation.

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Materials Chemistry,Polymers and Plastics,General Chemistry,Materials Chemistry,Polymers and Plastics,General Chemistry

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