Rheological, thermal, and electrical characterization polyamide/polypropylene blend composites containing hybrid filler: Boron nitride and reduced graphene oxide-Reference-Cited by-同舟云学术

Rheological, thermal, and electrical characterization polyamide/polypropylene blend composites containing hybrid filler: Boron nitride and reduced graphene oxide

Published:2021-04 Issue:2 Volume:2 Page:134-144
ISSN:2690-3857
Container-title:SPE Polymers
language:en
Short-container-title:SPE Polymers

Author:

Seyed Esfahani Seyed Armin¹,Ghahramani Nikoo²,Mehranpour Milad¹^ORCID,Nazockdast Hossein³

Affiliation:

1. Science and Research Branch Islamic Azad University Tehran Iran

2. Department of Chemical and Biological Engineering The University British Columbia Vancouver British Columbia Canada

3. Polymer Engineering Department Amirkabir University of Technology Tehran Iran

Publisher

Wiley

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pls2.10041

Reference57 articles.

1. Enhanced thermal conductivity of epoxy nanocomposites filled with hybrid filler system of triethylenetetramine-functionalized multi-walled carbon nanotube/silane-modified nano-sized silicon carbide

2. Preparation and properties of high-performance polyethersulfone composites reinforced by modified silicon nitride

3. Preparation and properties of Si3N4/PS composites used for electronic packaging

4. Interfacial modification of boron nitride nanoplatelets for epoxy composites with improved thermal properties

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