Enhancing Surface Roughness and Tensile Strength of Electrodeposited Copper Foils by Composite Additives-Reference-Cited by-同舟云学术

Enhancing Surface Roughness and Tensile Strength of Electrodeposited Copper Foils by Composite Additives

Published:2022-01-17 Issue: Volume: Page:2100735
ISSN:1862-6300
Container-title:physica status solidi (a)
language:en
Short-container-title:Physica Status Solidi (a)

Author:

Wang Shao Peng¹²,Wei Kun Xia¹²^ORCID,Wei Wei¹²^ORCID,Du Qing Bo¹²,Alexandrov Igor V.²³

Affiliation:

1. School of Materials Science and Engineering Changzhou University Changzhou 213164 P. R. China

2. Jiangsu Key Laboratory of Materials Surface Science and Technology National Experimental Demonstration Center for Materials Science and Engineering, Sino-Russian Joint Laboratory of Functional Nanostructured Materials Changzhou University Changzhou 213164 P. R. China

3. Department of Physics Ufa State Aviation Technical University 12 K. Marx St. Ufa 450008 Russia

Publisher

Wiley

Subject

Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/pssa.202100735

Reference25 articles.

1. Construction of NiCo/graphene nanocomposite coating with bulges-like morphology for enhanced mechanical properties and corrosion resistance performance

2. Microstructure of combined electroless and galvanic deposits on roll annealed copper foils and copper single crystals

3. Replacing Copper Wires with Carbon Nanotube Wires in Electrical Transformers

4. Competitive Effect of Leveler's Electrochemical Behavior and Impurity on Electrical Resistance of Electroplated Copper

5. Improving strength and high electrical conductivity of multi-walled carbon nanotubes/copper composites fabricated by electrodeposition and powder metallurgy

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