Affiliation:
1. Tianjin Key Laboratory of Materials Laminating Fabrication and Interface Control Technology School of Materials Science and Engineering Hebei University of Technology Tianjin 300130 P. R. China
2. School of Physics and Electronic Information Yan'an University Yan'an 716000 P. R. China
Abstract
Porous Cu–Al–Ni shape memory alloys (SMAs) are fabricated via powder metallurgy method using Cu, Al, Ni powders and Cu–Al–Ni alloy powder as raw materials, respectively. It is found that the two kinds of specimens have similar macroscopic morphologies: connected pores are uniformly distributed in the Cu–Al–Ni matrix, forming a 3D network structure. By comparison, the specimen fabricated using alloy powder has much finer microstructures than the specimens fabricated using Cu, Al, Ni powders. After adding Ce element to the latter, the microstructure of the Cu–Al–Ni matrix is significantly refined because of the formation of Ce‐rich particles. Damping tests show that the latter has superior damping capacity than the former. With the increase of Ce content, the damping of the latter increases first and then decreases. When the Ce content reaches 0.05 wt%, the highest damping can be achieved. Correlated mechanisms are discussed based on the microstructural observations.
Funder
National Natural Science Foundation of China
Natural Science Foundation of Hebei Province
Subject
Materials Chemistry,Electrical and Electronic Engineering,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,Electronic, Optical and Magnetic Materials