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Effects of the solution flow rate on the growth of aluminum etch tunnels

  • Published:2022-07-28 Issue:1 Volume:5 Page:
  • ISSN:2577-8196
  • Container-title:Engineering Reports
  • language:en
  • Short-container-title:Engineering Reports

Author:

You Pengfei12ORCID,Chen Jiageng13,Yu Wei3,Lu Wei13,Yang Hui1,Chen Suobin1,Ma Junhong2,Zhao Ganggang13,Liu Pengfei1,Li Xinfang1,Chen Changke14

Affiliation:

1. Xinjiang Joinworld Company Limited Urumuqi China

2. School of Chemical Engineering and Technology Xinjiang University Urumuqi China

3. Institute of Engineering Technology University of Science and Technology Beijing 30 Xueyuan Road Beijing China

4. Xinjiang Aluminum Based Electronic Materials Engineering Technology Research Center Urumuqi China

Publisher

Wiley

Subject

General Engineering,General Computer Science

Cited by 1 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of current density on the growth of aluminum etch tunnels;International Journal of Electrochemical Science;2023-10
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