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Crosstalk noise analysis in ternary logic multilayer graphene nanoribbon interconnects using shielding techniques

  • Published:2020-10-16 Issue:12 Volume:48 Page:2041-2055
  • ISSN:0098-9886
  • Container-title:International Journal of Circuit Theory and Applications
  • language:en
  • Short-container-title:Int J Circ Theor Appl

Author:

Kolanti Tulasi Naga Jyothi1ORCID,Kerehalli Shankar Rao Vasundhara Patel1

Affiliation:

1. Department of Electronics and Communication Engineering B.M.S. College of Engineering Bangalore India

Publisher

Wiley

Subject

Applied Mathematics,Electrical and Electronic Engineering,Computer Science Applications,Electronic, Optical and Magnetic Materials

Cited by 6 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Performance analysis of Cu-MWCNT bundled HCTSVs using ternary logic;e-Prime - Advances in Electrical Engineering, Electronics and Energy;2023-09

2. Impact of Polymer Liners on Crosstalk Induced Delay of Different TSV Shapes;IETE Journal of Research;2022-08-18

3. Performance Analysis of CNT Bundle Interconnects in Various Low-k Dielectric Media;ECS Journal of Solid State Science and Technology;2022-06-01

4. Investigation of Crosstalk Issues for MWCNT Bundled TSVs in Ternary Logic;ECS Journal of Solid State Science and Technology;2022-03-01

5. A comprehensive comparative study of the performance of carbon‐ and copper‐based interconnects in ultra‐large‐scale integrated circuits;International Journal of Circuit Theory and Applications;2021-05-13
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