Development of Pyr‐TPA as Interfacial Passivation Layer Enabling Efficient and Stable n–i–p Perovskite Solar Cells

Author:

Liang Lusheng123,Zhang Zilong123,Li Yuheng123,Yu Xuteng123,Lin Fulin123,Xu Yuan4,Lan Zhang4,Cavazzini Marco5,Pozzi Gianluca5,Orlandi Simonetta5,Gao Peng123ORCID

Affiliation:

1. State Key Laboratory of Structural Chemistry Fujian Institute of Research on the Structure of Matter Chinese Academy of Sciences Fuzhou Fujian 350002 China

2. Xiamen Key Laboratory of Rare Earth Photoelectric Functional Materials Xiamen Institute of Rare Earth Materials Xiamen 361021 China

3. Laboratory for Advanced Functional Materials Xiamen Institute of Rare Earth Materials Chinese Academy of Sciences Xiamen 361021 China

4. College of Materials Science and Engineering Huaqiao University Xiamen 361021 China

5. Institute of Chemical Sciences and Technologies “Giulio Natta” of National Research Council 20133 Milano Italy

Abstract

Interfacial passivation is a crucial technique for improving the performance of perovskite solar cells (PSCs) by suppressing nonradiative recombination. Incorporating electron‐rich functional groups into organic semiconductors can combine the advantages of Lewis bases and organic semiconductors to achieve defect passivation of perovskite films and interfacial charge transport improvement simultaneously. However, interlayers generated by organic semiconductors are often destroyed during the deposition of the hole transport layer (HTL) in n–i–p PSCs. This prevents the accurate evaluation of interfacial passivation effects. Herein, a pyromellitic derivative, 2,6‐bis(4‐(bis(4‐methoxyphenyl)amino)phenyl)pyrrolo[3,4‐f]isoindole‐1,3,5,7(2 H,6 H)‐tetraone (Pyr‐TPA), containing four carbonyl groups that can passivate defects and enhance hole transport while simultaneously acting as a stable interlayer at the perovskite/HTL interface due to its ideal solubility profile is introduced. As a result, Pyr‐TPA as an interlayer can minimize nonradiative recombination loss, resulting in a power conversion efficiency of up to 24.16%. Additionally, the interfacial Pyr‐TPA passivation layer also exhibits strong resistance to moisture and ion migration, leading to enhanced long‐term ambient stability of PSCs based on this material. Findings provide valuable insights into developing efficient and stable PSCs with simple and effective organic semiconductor interfacial passivation materials.

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Electrical and Electronic Engineering,Energy Engineering and Power Technology,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

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