Affiliation:
1. Science and Technology on Power Sources Laboratory Tianjin Institute of Power Sources China Electronics Technology Group Corporation (CETC) Tianjin 300384 China
2. School of Materials Science and Engineering Tianjin Key Laboratory of Molecular Optoelectronic Sciences Tianjin University Tianjin 300350 China
3. China Electronics Technology Group Corporation (CETC) Lan Tian Technology Co., Ltd. Tianjin 300384 China
4. Hubei Longzhong Laboratory Xiangyang 441000 China
Abstract
Multijunction solar cells that employ III–V semiconductors are highly efficient, lightweight, and flexible, rendering them excellent candidates for use in automobiles, satellites, or flexible electronics. To improve the operational stability of these high‐efficiency solar cells for practical applications, herein an innovative method for encapsulating high‐performance flexible III–V solar cells is proposed, which enables solar cell with a photoelectric conversion efficiency of 32.72% to maintain an efficiency of 31.67% after packaging under the AM1.5 global spectrum. The module remains the same efficiency of ≈29.7% under AM0 after encapsulation. The key to this approach is electrostatically spraying and curing fluorinated ethylene propylene materials to create a flexible, cost‐effective, and efficient encapsulation layer for III–V solar cells. The proposed encapsulation method demonstrates excellent adhesion, barrier properties, easy scalability, and long‐term stability, enabling enhanced performance, extended lifetimes, and improved reliability of III–V solar cells.
Funder
National Natural Science Foundation of China
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials