Affiliation:
1. Division Photovoltaics Fraunhofer Institute for Solar Energy Systems ISE 79110 Freiburg Germany
2. PV2+ GmbH 79110 Freiburg Germany
3. Centre for HRTEM Nelson Mandela University Gqeberha 6001 South Africa
Abstract
Herein, a novel strategy is introduced to reduce the consumption of scarce materials in silicon heterojunction solar cells by combining approaches for Ag replacement in the metallization and a reduction of the indium tin oxide layer thickness: a Ti layer deposited by physical vapor deposition serves both as the contact layer of a copper‐based metallization and after electrochemical oxidation as capping layer enabling the use of a thinner transparent conductive oxide. Further, the TiOx layer can build an encapsulation layer. While oxygen evolution and metal dissolution are found to be critical side reactions, a nonaqueous electrolyte is found in which these reactions can be avoided. The application on silicon heterojunction solar cells shows promising first results, exhibiting a short circuit current density of 35 mA cm−2 and a cell efficiency of close to 21% despite nonoptimized layer thicknesses.
Funder
Bundesministerium für Wirtschaft und Energie
Subject
Electrical and Electronic Engineering,Energy Engineering and Power Technology,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials
Cited by
2 articles.
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