Author:
Patel Kaushal S.,Kohl Paul A.,Bidstrup-Allen Sue Ann
Subject
Materials Chemistry,Polymers and Plastics,Surfaces, Coatings and Films,General Chemistry
Reference16 articles.
1. ; Ed. Microelectronics Packaging Handbook. Van Nostrand-Reinhold: New York, 1997.
2. Polymer dielectrics for multichip module packaging
3. Stress development in supported polymer films during thermal cycling
4. ; In Polyimides: Materials, Chemistry and Characterization; ; Eds.; Elsevier: Amsterdam, 1989; p 549.
5. Internal Stress Development In Spin Coated Polyimide Films
Cited by
6 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献