DEPOSITION OF THE STOICHIOMETRIC COATINGS BY REACTIVE MAGNETRON SPUTTERING

Author:

Sagalovich Alex1ORCID,Dudnik S23,Sagalovych Vladislav4

Affiliation:

1. Pjsc Fed

2. NSC "KIPT" (Kharkiv

3. STC "Nanotechnology" (Kharkiv

4. Stc Nanotechnology

Publisher

Wiley

Reference23 articles.

1. Parhomenko V.D. Cybulev P.N. Krasnokutskij Yu.I. Tehnologiya plazmohimicheskih proizvodstv. - K.: Vischa shkola 1991.

2. Danilin B.S. Primenenie nizkotemperaturnoj plazmy dlya naneseniya tonkih plenok. - M.: Energoizdat 1989.

3. Chechuro Yu.A. Spiridonov M.A Lavrov A.V. i dr. Osazhdenie plenok TiN magnetronnym metodom v usloviyah promyshlennogo primeneniya// Vakuumnaya tehnika i tehnologiya. - 1992. - T. 11 № 1.- S. 7-12.

4. Sejdman L.A. Poluchenie plenok nitrida titana reaktivnym magnetronnym//Elektronnaya tehnika. - 1985. - Ser. 2 Vyp. 2 (175). - S. 69-75.

5. Mercs D. Lapostolle F Perry F. et. al. Enhanced deposition rate of high quality stoichiometric ceramic compound reactively sputter deposited at low pressure by modulating the discharge current at low frequency//Surface and Coating Technology. - 1999. - Vol. 116-119. - P. 916-921.

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