Fluid Microchannel Encapsulation to Improve the Stretchability of Flexible Electronics-Reference-Cited by-同舟云学术

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Fluid Microchannel Encapsulation to Improve the Stretchability of Flexible Electronics

Published:2021-12-16 Issue: Volume: Page:2101126
ISSN:2365-709X
Container-title:Advanced Materials Technologies
language:en
Short-container-title:Adv Materials Technologies

Author:

Jin Peng¹²,Wang Peng¹²,Pang Wenbo¹,Wang Hanchen¹,Jiao Yang¹²,Zhang Jinsong¹²,Lu Bingwei¹²,Liu Bin¹,Chen Ying³⁴,Ma Yinji¹²,Feng Xue¹²^ORCID

Affiliation:

1. AML Department of Engineering Mechanics Tsinghua University Beijing 100084 China

2. Center for Flexible Electronics Technology Tsinghua University Beijing 100084 China

3. Institute of Flexible Electronics Technology of THU Jiaxing Zhejiang 314000 China

4. Qiantang Science and Technology Innovation Center Hangzhou 310016 China

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

Link

https://onlinelibrary.wiley.com/doi/pdf/10.1002/admt.202101126

Reference62 articles.

1. Microfluidics for flexible electronics

2. Materials, Structures, and Functions for Flexible and Stretchable Biomimetic Sensors

3. Mechanics of pressure driven transfer printing for stamp with micropillars

4. Flexible Hybrid Electronics for Digital Healthcare

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4. Coaxial Electrohydrodynamic Printing of Microscale Core–Shell Conductive Features for Integrated Fabrication of Flexible Transparent Electronics;ACS Applied Materials & Interfaces;2023-12-22

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