Affiliation:
1. State Key Laboratory of Intelligent Manufacturing Equipment and Technology Huazhong University of Science and Technology Wuhan 430074 China
2. Key Laboratory of Metallurgical Equipment and Control Technology of Ministry of Education Hubei Key Laboratory of Mechanical Transmission and Manufacturing Engineering Wuhan University of Science and Technology Wuhan 430081 China
3. Beijing National Laboratory for Molecular Sciences Key Laboratory of Organic Solids Institute of Chemistry, Chinese Academy of Sciences Beijing 100190 China
4. Key Laboratory of Thermo‐Fluid Science and Engineering of Ministry of Education Frontier Institute of Science and Technology, Xi'an Jiaotong University Xi'an 710054 China
5. Shenzhen Key Laboratory of Soft Mechanics & Smart Manufacturing Department of Mechanics and Aerospace Engineering Southern University of Science and Technology Shenzhen 518055 China
6. School of Energy and Power Engineering Huazhong University of Science and Technology Wuhan 430074 China
Abstract
AbstractElectronic thin films play a ubiquitous role in microelectronic devices and especially hold great promise for flexible electronics, energy conversion and storage, and biomedical applications. Their characterizations, including ultra‐thin, large‐scale dimensions, stretchability, and conformal ability to curved or 3D structures, present new challenges for thin film fabrication based on the solution method. Electrospray deposition emerges as a feasible method for fabricating large‐area, flexible, and curved films. It offers many advantages such as material adaptability, controlled atomization, tunable film morphology, and shape retention on complex substrates. These advantages make it a key method for fabricating high‐performance films on large‐area, 3D surfaces. This work presents a comprehensive review of the mechanisms, processes, applications, and equipment of electrospray deposition. First, the fundamental principles of electrospray deposition are introduced, focusing on the mechanisms and scaling laws of liquid atomization. Moreover, the control methods for electrospray modes, structures, and film morphology are discussed. These advanced control methods pave the way for the fabrication of smart skins, wearable devices, and energy conversion and storage components. Finally, this work introduces three types of electrospray deposition manufacturing equipment to illustrate the advantages of electrospray deposition for large‐area, and 3D surface manufacturing.
Funder
National Key Research and Development Program of China
National Natural Science Foundation of China