Considerations for the Design and Rapid Manufacturing of Pop‐Up MEMS Devices

Author:

Ramirez Serrano Francisco12ORCID,Steinhardt Emma1,Wood Robert J.1

Affiliation:

1. Harvard John A. Paulson School of Engineering and Applied Sciences 150 Western Ave Allston MA 02134 USA

2. Ecole Polytechnique Fédérale de Lausanne (EPFL) Lausanne 1015 Switzerland

Abstract

AbstractThe rising number of devices created using pop‐up microelectromechanical systems (MEMS) and related folding‐based assembly techniques highlights the need for robust design and manufacturing workflows to support the wide range of device variations. To push the bounds of miniaturization, design for manufacturing is key in dealing with fabrication challenges. Iterative building of intermediate device prototypes is a promising way to explore an often very large design space and can highlight mechanical limitations that may not be obvious to the designer. Manufacturing of pop‐up MEMS devices is, however, typically a lengthy process with lamination taking a significant percentage of the build time, compared to layer machining and component assembly. To expedite the design process, researchers often prototype multiple iterations at larger scales prior to committing to at‐scale designs. In this study, an at‐scale rapid prototyping workflow for pop‐up MEMS devices is introduced. This study also includes flexure design considerations for castellated hinges, to approach the behavior of an ideal pin joint. The new proposed workflow uses more accessible lower‐cost equipment and materials and reduces lamination time by over 95% (10 min lamination vs a 3.5 h lamination) compared to the previous heated press process, which is validated through a series of prototypes.

Funder

Army Research Office

Publisher

Wiley

Reference49 articles.

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3. M. E. W.Nisser S. M.Felton M. T.Tolley M.Rubenstein R. J.Wood in2016 IEEE/RSJ Int. Conf. on Intelligent Robots and Systems (IROS) 2016 pp.1254–1261.

4. C.Karakadioğlu M.Askari O.Özcan in2017 IEEE Int. Conf. on Advanced Intelligent Mechatronics (AIM) 2017 pp.247–252.

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