Tunable Fabrication of MAPbX3 Triangular‐Micro‐Wires Array for Constructing High Sensitivity Photodetector

Author:

Xu Xiuzhen1,Xiong Yuting1,Liu Wenfei2,Hao Dandan1,Ji Zhenkai1,Zhan Yiqiang3,Huang Jia1,Xu Xiaobin1ORCID

Affiliation:

1. Key Laboratory of Advanced Civil Engineering Materials of Ministry of Education Key Laboratory of D&A for Metal‐Functional Materials School of Materials Science & Engineering Tongji University Shanghai 201804 China

2. Apple One Apple Park Way Cupertino CA 95014 USA

3. Center for Micro Nano Systems School of Information Science and Technology (SIST) Fudan University Shanghai 200433 China

Abstract

AbstractOrganic‐inorganic hybrid perovskite (MAPbX3) is known having excellent photoelectric properties. Compared to polycrystalline films, perovskite micro/nanowires can provide improved optoelectronic properties, mechanical flexibility, and adaptability due to higher crystallinity. However, their economical, scalable, and controllable fabrication remains a challenge. In this work, the authors report a facile way to fabricate high‐quality MAPbX3 triangular‐micro‐wires (TMWs). The Si/SiO2 substrate with triangular‐micro‐trenches (TMTs) array serves as the template for the growth of MAPbX3 TMWs array through blade coating. The MAPbX3 TMW first nucleated at the trench bottom, which facilitating the nanowire growth with high crystallinity. In addition, the size and periodicity of TMTs array can be independently controlled, providing potential for scale‐up device applications. The photodetectors fabricated with these MAPbI3 TMWs show excellent responsivity of (144.5 ± 2.1) A/W and specific detectivity of (2.7 ± 0.02) × 1011 Jones under weak light (0.5 µW cm−2). Their photoresponse to pulsed light is stable and reproducible, with rise and decay times of 7.5 and 6.0 ms, respectively. Finally, with the demonstration of the image sensor application, MAPbX3 TMWs array is anticipated to be suitable for large‐area, high‐performance integrated optoelectronics.

Funder

National Natural Science Foundation of China

Publisher

Wiley

Subject

Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science

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