Topological Flexible 3D Microwave Perfect Absorber

Author:

Lv Wenjing12ORCID,Li Mengyao1,Wang Feng3,Qin Haoye1,Song Qinghua13ORCID,Zhu Pengfei45,Li Bo13ORCID

Affiliation:

1. Tsinghua Shenzhen International Graduate School Tsinghua University Shenzhen 518055 P. R. China

2. State Key Laboratory of New Ceramics and Fine Processing, School of Materials Science and Engineering Tsinghua University Beijing 100084 P. R. China

3. Suzhou Laboratory Suzhou 215000 P. R. China

4. FoShan (Southern China) Institute for New Materials Foshan 528000 P. R. China

5. Shenzhen Adventure Tech Co. Ltd. Shenzhen 518053 P. R. China

Abstract

AbstractIn this work, an approach to achieve perfect absorption and microwave absorption enhancement is proposed by combining traditional wave‐absorbing materials with metamaterials. Specifically, an absorbing basement membrane (BM) is integrated with 3D woodpile (WP) photonic crystals, both of which are composed of flexible silicon materials as matrix and carbonyl iron powder (CIP) as absorbent. Direct ink writing (DIW) is used to fabricate the 3D photonic crystals with either single or coupled concentrations of absorbent. Experiments show that the 10‐dB bandwidth of the integrated absorber can reach 10 GHz with a wide elevation angle of incidence. The absorber composed of BM and WP with coupled concentrations of absorbent leads to perfect absorption with a maximum absorption of over 100 dB at an elevation angle of 30°. By changing the concentration of absorbent in BM, the frequency of perfect absorption can be engineered in the range of 6–16 GHz. Such absorption singularity reveals an experimentally observable topological charge that confirms the robustness of the singularity of perfect absorption. The topologically protected flexible 3D microwave absorber offers exceptional performance for versatile scenarios and enriches the studies on topology arising from scattering singularity.

Funder

National Natural Science Foundation of China

Shenzhen Science and Technology Innovation Program

National Key Research and Development Program of China

Publisher

Wiley

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