Affiliation:
1. College of Chemistry and Environmental Engineering Shenzhen University Shenzhen 518060 China
2. College of New Materials and New Energies Shenzhen Technology University Shenzhen 518118 China
3. University Engineering Research Center of Crystal Growth and Applications of Guangdong Province Shenzhen Technology University Shenzhen 518118 China
Abstract
AbstractTransient electronics with degradability or dissolvability on demand possess remarkable characteristics for wearable, bioelectronic, and implanted electronic devices. While synthetic materials have made significant progress in degradability and stretchability, they suffer from intrinsic limitations, including low degradation rates, poor mechanical compliance, and high production cost, which restrict the growth of transient electronic devices. Herein, a versatile fabrication strategy is presented for transient electronics that combine a resilient biopolymer substrate (gelatin biogels) with liquid metal (Galinstan). The circuits made from gelatin biogel‐based and liquid metal are mechanically resilient and durable, exhibiting good compliance with irregular and deformable surfaces, and thus can withstand long‐term exposure to dynamic deformation (about 60 000 cycles at a strain of 50%). More importantly, gelatin biogels are naturally derived and endowed with thermally reversible gelling, which enables on‐demand rapid dissolution and recycling of the materials. As a proof‐of‐concept, transient circuit‐based capacitive sensors, which can be degraded within 20 s, are fabricated for monitoring finger touching, morse code generation, and electrical touchpad. Such a strategy provides a guideline for designing transient electronics with a combination of biopolymer gels and liquid metal, and this approach is anticipated to find applications in human–machine interfaces and wearable devices.
Funder
National Natural Science Foundation of China
Subject
Industrial and Manufacturing Engineering,Mechanics of Materials,General Materials Science
Cited by
3 articles.
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